Provided Services
ARIM-SETI broadly supports research and development in the following areas: new materials for use in semiconductor devices, devices and integrated circuits featuring novel materials, new functionalities, or specialized structures, high-density integration of such devices, and application systems utilizing integrated circuits.
Integrated Devices, Materials, and Processes for CMOS Integrated Circuits and Sensors
ARIM-SETI supports the design, prototyping, and evaluation of integrated devices combining CMOS integrated circuits and sensors, as well as related materials and process research and development.
Power Semiconductor Devices, Materials, and Processes using SiC/GaN
Support is provided for the design, prototyping, and evaluation of power semiconductor devices using wide bandgap materials such as SiC and GaN, along with R&D on associated materials and processes.
2D Semiconductor Devices, Materials, and Processes for Next-Generation Logic ICs
Research and development is supported for 2D semiconductor materials such as MoS2 (sulfides), graphene, and hBN, including device prototyping and material/process studies for next-generation logic integrated circuits.
High-Frequency Semiconductor Devices, Materials, and Processes for Future 6G Communication
Support is provided for the R&D of high-frequency semiconductor devices and antennas operating in the tens of GHz to THz range, including integration technologies, materials, and processes for future 6G applications.
Optoelectronic Integration
R&D is supported for optical-to-electrical conversion and signal transmission in next-generation semiconductor chips, including devices such as semiconductor lasers and optical waveguides, optical integrated circuits, and related materials and processes.
Solar Cells
Support is offered for R&D focused on materials and processes for diverse next-generation solar cells, including those based on silicon, III-V compounds, perovskites, and quantum dots.
Others
ARIM-SETI also supports prototyping and R&D of materials and processes for organic semiconductors, next-generation memory, spintronics devices, and quantum devices.
Notable evaluation techniques available include:
・Testing under cryogenic conditions
・Biocompatibility evaluation
・In-situ process analysis using SPring-8 or X-ray diffraction
・Visualization of defect and strain distributions
・High-sensitivity potential and charge measurements using electron microscopy
Provided Services List
ARIM-SETI_Provided Services Chart [PDF形式/100KB]
Design
※Clicking on the name of an implementing institution will open a page detailing the services provided by that institution.
- CMOS Circuit (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ.)
- Analogue Circuit (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ.)
- Digital Circuit (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ.)
- MEMS and Sensor Device (Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., Kyoto Univ., AIST, Toyota Tech. Inst.)
- Semiconductor Device (Tohoku Univ., Toyohashi Univ. Tech., Hiroshima Univ., Hokkaido Univ., NIMS, Science Tokyo, Nagoya Univ., Kyoto Univ., Univ.Tsukuba, AIST, JAIST, Toyota Tech. Inst., IMS)
- Optical Device (Tohoku Univ., Toyohashi Univ. Tech., Hiroshima Univ., NIMS, Kyoto Univ., Univ. of Osaka, Toyota Tech. Inst.)
- Optical Interconnect (Tohoku Univ., Toyohashi Univ. Tech., Hiroshima Univ., Science Tokyo, Kyoto Univ., Univ. of Osaka)
- Integration of the above (Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ.)
Processing
※Clicking on the name of an implementing institution will open a page detailing the services provided by that institution.
- CVD (Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., Hokkaido Univ., NIMS, Nagoya Univ., Kyoto Univ., Univ. of Osaka, AIST, Nagoya Tech. Inst.)
- ALD (Hiroshima Univ., Hokkaido Univ., NIMS, Kyoto Univ., AIST, Toyota Tech. Inst.)
- Multilayer Interconnect Formation (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., Kyoto Univ.)
- FIB (Tohoku Univ., Univ. of Tokyo, Hokkaido Univ., NIMS, Nagoya Univ., Kyoto Univ., Kyushu Univ., Univ.Tsukuba, JAIST, Nagoya Tech. Inst.)
- Etching (Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., NIMS, Nagoya Univ., Kyoto Univ., Univ. of Osaka, UEC, Toyota Tech. Inst., Kagawa Univ.)
- Nanoimprint (Kyoto Univ., Univ. of Osaka)
Evaluation
※Clicking on the name of an implementing institution will open a page detailing the services provided by that institution.
- Power Semiconductors Evaluation (Hiroshima Univ., Nagoya Univ., Kyoto Univ., Univ.Tsukuba, AIST, Waseda Univ.)
- MOSFET Evaluation (Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., Science Tokyo, Nagoya Univ., Kyoto Univ., Univ.Tsukuba, AIST, Waseda Univ., JAIST)
- Electrical Property Evaluation (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., NIMS, Nagoya Univ., Kyoto Univ., Univ. of Osaka, CIST, Univ.Tsukuba, AIST, Waseda Univ., IMS)
- X-ray Analysis (Univ. of Tokyo, Hiroshima Univ., Hokkaido Univ., NIMS, Kyoto Univ., Kyushu Univ., Shinshu Univ., Nagoya Tech. Inst., IMS, JAEA, QST, NAIST)
- XPS (Univ. of Tokyo, Hiroshima Univ., NIMS, Nagoya Univ., Kyushu Univ., Univ.Tsukuba, AIST, JAIST, Nagoya Tech. Inst., IMS, JAEA, NAIST)
- Spectroscopic Analysis (Hiroshima Univ., Hokkaido Univ., NIMS, Nagoya Univ., Kyoto Univ., Kyushu Univ., Univ.Tsukuba, AIST, JAIST, Nagoya Tech. Inst., IMS, QST)
- Raman Spectroscopy (NIMS, Univ. of Osaka, Kyushu Univ., CIST, Univ.Tsukuba, Toyota Tech. Inst., NAIST)
- TEM (Tohoku Univ., Univ. of Tokyo, NIMS, Nagoya Univ., Kyoto Univ., Univ. of Osaka, Kyushu Univ., JAIST, Nagoya Tech. Inst., NAIST)
- SEM (Tohoku Univ., Univ. of Tokyo, Toyohashi Univ. Tech., Hiroshima Univ., NIMS, Nagoya Univ., Kyoto Univ., Univ. of Osaka,Kyushu Univ., Univ.Tsukuba, JAIST, Nagoya Tech. Inst., NAIST, Kagawa Univ.)
- AFM (Univ. of Tokyo, Hiroshima Univ., Univ. of Osaka, Univ.Tsukuba, NIMS, Nagoya Univ., Kyoto Univ., JAIST, Toyota Tech. Inst.)
- Rheological Property Evaluation (Yamagata Univ.)
- Interface Evaluation (Univ. of Tokyo, Hiroshima Univ., Univ. of Osaka, JAEA)
Services Provided by Each Institution
※Clicking on the name of an implementing institution will open a page detailing the services provided by that institution.
Core Institutions
【Institutions for support of circuit prototype】
【Institutions for support of materials and processes】
Network Institutions
- Chitose Institute of Science and Technology (CIST)
- Yamagata University
- University of Tsukuba
- National Institute of Advanced Industrial Science and Technology (AIST)
- Waseda University
- The University of Electro-Communications (UEC)
- Japan Advanced Institute of Science and Technology (JAIST)
- Shinshu University
- Nagoya Institute of Technology
- Toyota Technological Institute
- Institute for Molecular Science (IMS)
- Japan Atomic Energy Agency (JAEA)
- National Institutes for Quantum Science and Technology (QST)
- Nara Institute of Science and Technology (NAIST)
- Kagawa University