Crystal structure analysis, interface structure analysis, defect and structural fluctuation analysis, compositional analysis including dopant distribution, and valence/bonding state analysis of semiconductor materials/devices using electron microscopes (TEM/STEM)
Serial sectioning and 3D structural reconstruction using FIB-SEM
Provided Services (Provided in future)
Evaluation
Analysis of potential and charge distribution in semiconductor materials/devices using electron microscopy (such as electron beam holography) (After equipment installation and optimization, shared use is scheduled to begin around October 2026)