Planned Services (To Be Made Available Upon Completion of Operational Setup)
Design
Design for Integration of CMOS Integrated Circuits and High Value-Added Functions (Sensors, Photonics, etc.)
Design and analysis of impurity profiles and operating potentials (TCAD, Spectra)
Prototype
Prototype Fabrication of Integrated Circuits (up to 4-inch wafers; gate lengths: 1.5 μm and 5 μm) CMOS integrated circuits CMOS/JFET hybrid integrated circuits Integrated devices combining ICs with MEMS/sensors and functional materials Potential-detection type multimodal sensor arrays (light, ions, pressure, etc.)
Prototype Device Fabrication GaN, GaN/Si devices (μLEDs, μLED arrays) Optoelectronic devices using compound semiconductors (LEDs, solar cells) Optical waveguides (Si, SiGe processing) MEMS, microfluidic, and μTAS devices
Packaging (Wafer dicing and bonding)
Educational Programs Training courses on integrated circuit technology for professionals and students?(From n-MOS IC process to evaluation: 5-day program)
Evaluation
Wafer Process Evaluation Thin film thickness measurement, step height measurement, CD (critical dimension) measurement, and observation
Electrical characterization and evaluation of MOSFETs and CMOS integrated circuits
Provided Services (Provided in future)
Design
Design Feedback from Prototype Devices Extraction of device parameters from prototypes and feedback into design (within FY2026)
Prototype
Fine Processing for 8-inch Wafers Support for 8-inch wafer microfabrication (within FY2026)
Evaluation
Wafer Process Evaluation for 8-inch Wafers Thin film thickness measurement, step height measurement, CD measurement, and observation (within FY2026)