Design for Integration of CMOS Integrated Circuits and High-Value-Added Functions (e.g., Sensors, Photonics)
Prototype
Devices Integrating CMOS Integrated Circuits and High-Value-Added Functions
Silicon Optical Waveguides
Evaluation
Electrical characteristics of single transistor devices and integrated devices
High-speed, large-volume 3D mapping of structure and composition (using plasma FIB with FE-SEM, EDS, and SIMS)
Precise evaluation of atomic structure (atomic arrangement, composition, etc.) and electronic states (chemical bonding state, electronic levels, charge states, etc., using aberration-corrected STEM with EDS and EELS)
Provided Services (Provided in future)
Design
Companion support for CMOS integrated circuit (digital and analog) design (Service scheduled to begin around April 2026) (Information on VDEC and commercial shuttle services, etc.)
Design of CMOS integrated circuits (gate length: 5μm) (Service scheduled to begin around April 2026)
Prototype
Cu multilayer interconnect formation (Service scheduled to begin around April 2026)
CMOS devices (gate length: 5μm) (Service scheduled to begin around October 2026)
Evaluation
Electrical characteristics of CMOS integrated circuits (Service launch scheduled around October 2026)