University of Tsukuba

Provided Services (Already available)

Design

• Design and performance prediction of various devices using device simulators (online), including 3D-Si-based CMOS, 3D power semiconductor devices (GaN, SiC, Ga₂O₃), 3D solar cells, 3D photodiodes, and 2D/1D material-based devices.

Prototype

• Fine processing of various semiconductor devices, including photolithography, electron beam (EB) lithography, ion milling with endpoint detection, and focused ion beam (FIB) processing, as well as electrode formation and ultra-high-temperature annealing (up to 1800℃).

Evaluation

• Evaluation of semiconductor and power semiconductor devices (rated for 3 kV and 10 kV) under variable temperature conditions (10 K to room temperature), along with material characterization using XPS, UPS, LEIPS, and spectroscopic ellipsometry.

Provided Services (Provided in future)

To Be Determined