【公開日：2025.06.10】【最終更新日：2025.04.15】
課題データ / Project Data
課題番号 / Project Issue Number
24TU0143
利用課題名 / Title
振動型マイクロデバイス/Micro Vibration device fabrication
利用した実施機関 / Support Institute
東北大学 / Tohoku Univ.
機関外・機関内の利用 / External or Internal Use
外部利用/External Use
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）加工・デバイスプロセス/Nanofabrication（副 / Sub）計測・分析/Advanced Characterization
【重要技術領域 / Important Technology Area】（主 / Main）高度なデバイス機能の発現を可能とするマテリアル/Materials allowing high-level device functions to be performed（副 / Sub）-
キーワード / Keywords
ダイシング/ Dicing,高周波デバイス/ High frequency device,電子顕微鏡/ Electronic microscope,リソグラフィ/ Lithography,MEMS/NEMSデバイス/ MEMS/NEMS device,スパッタリング/ Sputtering,光リソグラフィ/ Photolithgraphy
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
NGUYEN HOANGHUNG
所属名 / Affiliation
NextQM Japan 合同会社
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）-
利用した主な設備 / Equipment Used in This Project
TU-158：芝浦スパッタ装置（加熱型）
TU-160：自動搬送 芝浦スパッタ装置（加熱型）
TU-251：SUSS ウェハ接合装置
TU-326：Zygo Nexview
TU-255：ディスコ ダイサ
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
This report summarizes the usage of MEMS fabrication equipment, including the sputter machine, dicer, microscope, and lithography tools, for the fabrication of a MEMS-based vibration device. The fabrication process was carried out successfully, and the overall results were satisfactory.
実験 / Experimental
The MEMS vibration device was fabricated using the following steps:
1. Thin Film Deposition (Sputtering): A metal layer was deposited onto the substrate using a sputter machine to form the conductive layer required for the device’s operation.
2. Lithography: Photoresist was spin-coated, exposed, and developed to define the electrode pattern.
3. Etching: Unwanted material was removed using wet or dry etching techniques to create the functional MEMS structure.
4. Dicing: The wafer was diced into individual devices with high precision to maintain structural integrity.
5. Inspection and Characterization: The fabricated devices were inspected under a microscope to ensure structural accuracy and quality.
結果と考察 / Results and Discussion
Sputter Machine: The deposition process was stable, achieving uniform thin films with good adhesion and dense thickness, which is crucial for the device’s functional layers (Fig. 1; 2)
Microscope: Inspection confirmed the devices shape, which is essential for device performance.
Dicer: The dicing process was precise, with minimal chipping and good edge quality, ensuring proper device dimensions. (Figure 3)
Lithography: Pattern transfer was successful, with well-defined features and no significant defects, maintaining accuracy for MEMS vibration components.
図・表・数式 / Figures, Tables and Equations
Figure 1. Surface of sputtered thin film
Figure 2. Cross-section of the sputtered thinfilm
Figure 3. Diced chip using dicer
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
All equipment performed within expected parameters. No major issues were encountered, and the fabricated MEMS vibration device met the desired specifications. Regular maintenance and calibration are recommended to ensure continued performance and reproducibility in future fabrication processes.
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件