【公開日：2025.06.10】【最終更新日：2025.05.16】
課題データ / Project Data
課題番号 / Project Issue Number
24UT0080
利用課題名 / Title
金属樹脂異種接合
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
内部利用（ARIM事業参画者以外）/Internal Use (by non ARIM members)
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）計測・分析/Advanced Characterization（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）マルチマテリアル化技術・次世代高分子マテリアル/Multi-material technologies / Next-generation high-molecular materials（副 / Sub）-
キーワード / Keywords
異種材料接着・接合技術/ Dissimilar material adhesion/bonding technology,電子顕微鏡/ Electronic microscope
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
陳 偉彦
所属名 / Affiliation
東京大学生産技術研究所
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
任 家興,MEI JIAJIE
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）,技術補助/Technical Assistance
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
The purpose of this experiment is to analyze the surface structure of metal and to examine the cross-sectional morphology of resin-metal joints after bonding. Understanding these structural characteristics is crucial for evaluating the interface properties and adhesion quality of the bonded materials. A Scanning Electron Microscope (SEM) was utilized to observe the microstructure of the metal surface before bonding. Additionally, after the bonding process, cross-sectional SEM analysis was conducted to assess the interface characteristics between the metal and resin, focusing on the adhesion and fracture behavior. By examining these microstructural details, we aim to gain insights into the effectiveness of the bonding process and the potential factors influencing interface reliability.
実験 / Experimental
The experiment began with sample preparation, where metal specimens were cleaned using an ultrasonic cleaner with ethanol to remove surface contaminants, then dried and stored in a controlled environment to prevent oxidation. Resin was prepared and applied to the metal surface using a controlled molding process. In the bonding process, the metal and resin were bonded under specific pressure and temperature conditions to ensure proper adhesion, and after curing, the bonded samples were cut into cross-sectional specimens using precision cutting equipment. For SEM (JSM-7800F) observation, the metal surface structure was examined before bonding to assess its initial morphology, and the cross-sectional area of the bonded samples was polished and coated with a conductive layer to enhance SEM imaging quality. SEM analysis was performed at various magnifications to evaluate the interface characteristics and fracture modes, ensuring a systematic analysis of the bonding interface and providing insights into the factors influencing adhesion performance.
結果と考察 / Results and Discussion
The results show that the treatment time has a significant effects on the morphology of the copper surface. With longer treatment time, the surface structures trasfer from granular shapes to needle-like structures. With growing size of the surface structures, the bonding strength with resin materials also increased. When the granular shapes cover the metal surface, the fracture mechanim was almost interface fracture, nearly no resin remained on the metal surface, while when needle-like structures were produced, resin residual was observed on the metal side and metal residual was also observed on the resin fracture side.
図・表・数式 / Figures, Tables and Equations
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件