【公開日：2025.06.10】【最終更新日：2025.05.28】
課題データ / Project Data
課題番号 / Project Issue Number
24UT1104
利用課題名 / Title
マイクロ表面テクスチャリング Three-dimensional Micro-patterning of the a-C:H Film
利用した実施機関 / Support Institute
東京大学 / Tokyo Univ.
機関外・機関内の利用 / External or Internal Use
外部利用/External Use
技術領域 / Technology Area
【横断技術領域 / Cross-Technology Area】（主 / Main）加工・デバイスプロセス/Nanofabrication（副 / Sub）-
【重要技術領域 / Important Technology Area】（主 / Main）次世代ナノスケールマテリアル/Next-generation nanoscale materials（副 / Sub）-
キーワード / Keywords
リソグラフィ/ Lithography,ナノシート/ Nanosheet
利用者と利用形態 / User and Support Type
利用者名（課題申請者）/ User Name (Project Applicant)
崔 埈豪
所属名 / Affiliation
東京都市大学理工学部 機械工学科
共同利用者氏名 / Names of Collaborators in Other Institutes Than Hub and Spoke Institutes
ARIM実施機関支援担当者 / Names of Collaborators in The Hub and Spoke Institutes
利用形態 / Support Type
（主 / Main）機器利用/Equipment Utilization（副 / Sub）-
利用した主な設備 / Equipment Used in This Project
報告書データ / Report
概要（目的・用途・実施内容）/ Abstract (Aim, Use Applications and Contents)
The fabrication of the 3D micro-patterning DLC punch tool through an eight-step process that starts with a photo-resist layer with the designed patterns. The last step includes surface smoothing of the etched 3D patterns. The micro-embossing process was used as an application of the fabricated micro-forming tool. The smoothed micro-punch tool is proven to obtain lower dimension tolerance, less defects, and overall reliability.
実験 / Experimental
First, photo-resist layer is coated on the aluminum metallic layer which consists of two consecutive steps explained as follows. First, Mikasa Opticoat (MS-B100) spin coater machine was employed to coat the hexamethyldisilazane (HMSD-OAP) coating at 4000 rpm and 1 minute. Then, AS ONE (TH-900) hot plate was used to bake it for 10 minutes at 400 K and then let the samples cool down for another 10 minutes. Second, the S1818 coating was deposited on the HMSD layer using the same spin coater for 1 minute at 2000 rpm. After, it was baked at 383K for 10 minutes and then cooled down for another 10 minutes. Afterwards, DWL66+2018 maskless exposure lithography system was utilized to print the previously designed patterns according to the input CAD file at a speed of 1.0 mm/s and exposure dose of 300 mJ/cm2. Then, the AZ 300MIF Developer was used to remove the unexposed region of the CAD design.
結果と考察 / Results and Discussion
After photo-resistace lithography prcross, the final thickness of the whole photo-resist layer was measured to be 1.5-2 μm. During the subsequent ion etching proceses, a 500 nm thin layer of the a-C:H amorphous film is deposited on the 3D designed array of the 3D micro-forming punch tool of all substrates. The purpose of this newly deposited layer is to reduce the surface roughness of the 3D array after the previous etching processes which in turn can have an impact on the friction properties of the punch during the micro-embossing process.
図・表・数式 / Figures, Tables and Equations
その他・特記事項（参考文献・謝辞等） / Remarks(References and Acknowledgements)
成果発表・成果利用 / Publication and Patents
論文・プロシーディング（DOIのあるもの） / DOI (Publication and Proceedings)
口頭発表、ポスター発表および、その他の論文 / Oral Presentations etc.
特許 / Patents
特許出願件数 / Number of Patent Applications：0件
特許登録件数 / Number of Registered Patents：0件